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SiC Ceramic Optical Path Board for Wafer Inspection Equipment Parallelism ≤0.02mm

Nom De Marque:	ZMSH
Numéro De Modèle:	Panneau de chemin optique en céramique SIC
MOQ:	5
Prix:	by case
Délai De Livraison:	2-4 semaines
Conditions De Paiement:	T / t

Informations détaillées

Description de produit

Informations détaillées

Lieu d'origine:

CHINE

Certification:

rohs

Pureté des matériaux:

Sic ≥ 99,999%

Conductivité thermique:

120–270 w / (m · k)

Indice de réfraction:

2.6–2.7

Planéité de surface:

≤ 1 μm

Rugosité de surface (RA):

≤0,01 μm

Température de fonctionnement:

-50℃ | 500℃

Détails d'emballage:

Emballage dans une salle de nettoyage à 100 niveaux

Description de produit

SiC Ceramic Optical Path Board Introduction

SiC Ceramic Optical Path Board for Wafer Inspection Equipment Parallelism ≤0.02mm

SiC Ceramic Optical Path Board for Wafer Inspection Equipment Parallelism ≤0.02mm 0

A Silicon Carbide (SiC) Optical Path Board is a high-precision optical substrate manufactured from ultra-high-purity silicon carbide ceramic, specifically designed for dual optical path systems in wafer inspection equipment. It leverages the core material properties of silicon carbide—exceptional hardness, ultra-low coefficient of thermal expansion, high thermal conductivity, and high refractive index—to provide a stable, thermally stable reference platform for optical sensors and imaging systems. Through precision grinding and polishing processes, it achieves nanoscale flatness and surface roughness. Its excellent chemical inertness and high stiffness ensure long-term performance in harsh semiconductor manufacturing environments, significantly enhancing inspection accuracy and equipment reliability.

SiC Ceramic Optical Path Board Key Technical Data

Parameter Category	Parameter Name	Typical Value/Range
Material Characteristics	Material Purity	SiC ≥99.999%
	Coefficient of Thermal Expansion	~4.5×10⁻⁶/℃
	Thermal Conductivity	120–270 W/(m·K)
	Refractive Index	2.6–2.7
	Elastic Modulus	>400 GPa
Functional Characteristics	Surface Flatness	≤1 μm
	Surface Roughness (Ra)	≤0.01 μm
	Operating Temperature	-50℃ ~ 500℃

SiC Ceramic Optical Path Board Characteristics

Feature Category	Parameter Name	Value/Specification
Weight Optimization	Ultra-Lightweight	Achieved via structural design and material selection
Environmental Stability	Ultra-High Stability	Exceptional resistance to thermal/mechanical stress
Thermal Performance	Coefficient of Thermal Expansion	Ultra-Low (e.g., ~4.5×10⁻⁶/℃)
Mechanical Property	Stiffness	High (e.g., Elastic Modulus >400 GPa)
Material Integrity	Density	High (e.g., ≥3.1 g/cm³)
Precision Metrics	Surface Flatness & Parallelism	≤0.02 mm
Dimensional Capability	Maximum Size	900 × 900 mm

SiC Ceramic Optical Path Board Main Application Areas

Silicon Carbide Optical Path Boards are critically applied in the following high-end fields due to their outstanding performance:

SiC Ceramic Optical Path Board for Wafer Inspection Equipment Parallelism ≤0.02mm 1

Semiconductor Inspection Equipment: Serves as the core substrate in dual optical path systems for wafer defect detection, film thickness measurement, and overlay accuracy analysis, ensuring optical path stability and measurement repeatability.
AR/VR Optical Systems: Used as a diffractive waveguide lens substrate (e.g., Meta Orion AR glasses), supporting wide field of view (70°+), low rainbow artifact display, and lightweight design (density ~3.1 g/cm³).
High-End Photoelectric Instruments: Functions as an optical platform in laser interferometers and spectral analysis equipment, reducing thermal drift and environmental vibration impacts on precision.
Photovoltaics and New Energy: Applied as a heat dissipation substrate for photovoltaic inverter power modules, utilizing its high thermal conductivity to improve cooling efficiency.

About ZMSH

ZMSH specializes in the customized services of silicon carbide (SiC) optical path boards. With sufficient reserves of ultra-high-purity silicon carbide raw materials (purity ≥99.999%), and leveraging advanced pressureless sintering and precision machining technologies (such as nanoscale mirror polishing and micro-channel processing), it can precisely control product performance. The company is equipped with fully automated production lines and a strict quality inspection system, supporting one-stop customization from design, prototyping to mass production, covering personalized needs for dimensions, shapes, hole positions, and functional characteristics (e.g., flatness ≤0.02mm). Simultaneously, we possess a comprehensive global logistics network and a rapid response mechanism to ensure efficient order delivery, providing high-reliability and high-performance silicon carbide ceramic solutions for fields such as semiconductors, optoelectronics, and new energy.

SiC Ceramic Optical Path Board for Wafer Inspection Equipment Parallelism ≤0.02mm 2

Q&A

1. Q: What are the key advantages of silicon carbide (SiC) optical path boards?

A: They offer ultra-low thermal expansion (~4.5×10⁻⁶/℃), high thermal conductivity (120–270 W/m·K), and exceptional stiffness (>400 GPa), ensuring nanoscale flatness (≤0.02mm) and stability under extreme conditions for precision optical systems.

2. Q: Where are silicon carbide optical path boards commonly used?

A: They are primarily used in semiconductor wafer inspection equipment (e.g., dual-optical-path baseplates), AR/VR waveguide substrates, laser interferometers, and high-power photonic devices due to their ability to maintain optical alignment and thermal stability.

Tags: #SiC Ceramic Optical Path Board, #Customized, #Wafer Inspection Equipment, #Parallelism ≤0.02mm

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