Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard Brittle Materials
The multi-wire diamond saw cutting machine is a high-efficiency, precision slicing equipment specifically designed for ultra-hard and brittle materials. It employs parallel cutting technology using multiple diamond-impregnated wires to simultaneously process multiple workpieces. This machine is primarily used for high-speed, high-efficiency, and high-precision multi-wafer cutting of materials such as silicon carbide (SiC), gallium nitride (GaN), sapphire, quartz, and ceramics, making it ideal for mass production in semiconductor, photovoltaic, and LED industries.
Compared to single-wire cutting machines, the multi-wire system significantly enhances productivity by enabling dozens to hundreds of slices per operation, while maintaining exceptional cutting accuracy (±0.02 mm) and surface quality (Ra <0.5 μm). Its modular design supports automatic loading, tension adjustment, and intelligent monitoring, meeting industrial continuous production requirements.
Multi-Wire Diamond Saw Cutting Machine Technical Data
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Item
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Parameter
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Item
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Parameter
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Maximum work size (Square material)
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220×200×350(mm)
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Main drive motor
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17.8kw×2
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Maximum work size (Circular material)
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Φ205×350(mm)
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Wiring/radio motor
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11.86kw×2
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Spindle spacing(Diameter × Length × Quantity)
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Φ250 ± 10 × 370 × 2 axis (mm)
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Workbench elevator motor
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2.42kw×1
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Principal axis
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650mm
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Workbench swing motor
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0.8kw×1
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Running speed
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1500m/min
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Arrangement motor
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0.45kw×2
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Diamond wire diameter
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Φ0.12～Φ0.25(mm)
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Tension motor
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4.15kw×2
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Lift speed
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225mm
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Mortar motor
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7.5kw×1
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Maximum Workbench Speed
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±12deg
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Storage
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300L
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Swing angle
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±3deg
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Flow rate
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200L/min
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Swing frequency
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About 30 times per minute
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Accuracy of temperature control
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±2℃
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Storage
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0.01～9.99mm/min
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Power voltage
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3*35+2*10(mm²)
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Flow rate
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0.01～300mm/min
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Compressed air supply
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0.4-0.6MPa
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Size
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3550×2200×3000(mm)
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Weight
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13500kg
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Diamond Wire Single-Line Cutting Machine Working Principle
The core operational mechanisms include:
1.Multi-Wire Synchronized Motion System:
- Dozens to hundreds of diamond wires run synchronously at speeds up to 1500 m/min, driven by guide wheels, achieving material cutting via diamond particle abrasion.
- Features closed-loop tension control (adjustable 15-130 N) to ensure uniform wire tension, preventing breakage or deviation.
2.Precision Feeding & Positioning System:
- Workpiece feeding is controlled by high-precision servo motors with linear guides, achieving positioning accuracy of ±0.005 mm.
- Optional vision alignment or laser tool setting enhances complex-shape cutting precision.
3.Cooling & Debris Management:
- High-pressure coolant (water- or oil-based) flushes the cutting zone to reduce thermal impact and remove debris, minimizing edge chipping.
- Equipped with multi-stage filtration to extend coolant lifespan.
4. Intelligent Control System:
- B&R servo drives (response time <1 ms) enable real-time dynamic adjustments of speed, tension, and feed rate.
- Supports parameter storage/recall and one-click material-specific mode switching.
Multi-Wire Diamond Saw Cutting Machine Key Features
1. High-Throughput Multi-Wafer Cutting:
- Maximum wire speed of 1500 m/min with 50-200 slices per run (material-dependent), boosting productivity 5-10x over single-wire systems.
- Optimized for SiC/GaN, achieving <100 μm kerf loss and 40% higher material utilization.
2. Precision Control & Intelligence:
- B&R servo system ensures ±0.5 N tension accuracy for stable cutting across material hardness levels.
- 10-inch HMI displays real-time parameters (speed, tension, temperature) and enables recipe storage/remote monitoring.
3. Modular Expandability:
- Optional robotic loading/unloading systems for unmanned production.
- Supports wire diameter switching (φ0.12-0.45 mm) for rough-to-finish processing versatility.
4. Industrial-Grade Reliability:
- High-strength cast/forged frame with <0.01 mm deformation under prolonged operation.
- Ceramic-coated/Tungsten carbide guide wheels and spindles (>8000-hour service life).
Multi-Wire Diamond Saw Cutting Machine Application Fields
1. Semiconductor Industry:
- SiC wafer dicing: For EV inverter and fast-charging module substrates.
- GaN epitaxial wafer cutting: 5G RF devices and microwave chips.
2. Photovoltaics:
- Mono/polycrystalline silicon ingot slicing: 1200 m/min speed with <±10 μm thickness variation.
3. LED & Optics:
- Sapphire substrate cutting: LED epitaxial wafers and camera covers with <20 μm edge chipping.
4. Advanced Ceramics & R&D:
- Alumina/AlN ceramic slicing: High-precision processing for aerospace thermal components.
ZMSH's services
ZMSH specializes in the R&D, production, and technical services of multi-wire diamond saw cutting systems, delivering integrated solutions from equipment to material processing for semiconductor industry clients. Our high-performance multi-wire diamond saws feature modular designs capable of high-efficiency multi-wafer cutting of ultra-hard brittle materials including SiC ingots, sapphire rods, and quartz glass, achieving maximum cutting speeds of 1500m/min while maintaining precision within ±0.02mm through intelligent tension control systems and B&R servo drives. We offer customized services tailored to diverse processing requirements, encompassing equipment parameter optimization, cutting process development, and contract processing for specialized materials (e.g., large-format SiC substrates or irregular sapphire components). Furthermore, our technical support team provides full-cycle assistance including equipment installation/commissioning, operator training, process optimization, and after-sales maintenance to ensure seamless transition from pilot to mass production. For both semiconductor manufacturers and research institutions, we deliver professional cutting solutions adapted to material properties (e.g., hardness, CTE) to optimize both processing efficiency and yield rates.
Multi-Wire Diamond Saw Cutting Machine Q&A
1. Q: What is the maximum cutting speed of a multi-wire diamond saw for silicon carbide?
A: Advanced multi-wire diamond saws achieve cutting speeds up to 1500 m/min for SiC wafers with ±0.02mm precision.
2. Q: How many wafers can a multi-wire saw cut simultaneously compared to single-wire?
A: Multi-wire saws typically cut 50-200 wafers per run (material-dependent), offering 5-10x higher productivity than single-wire systems.
Tag: #Multi-Wire Diamond Saw Cutting Machine, #Customized, #SiC/Sapphire/Ultra-Hard Brittle Materials Processing
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