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Created with Pixso. Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications

Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications

Nom De Marque: ZMSH
MOQ: 10
Délai De Livraison: 2-4 semaines
Conditions De Paiement: T/T
Informations détaillées
Lieu d'origine:
Shanghai, Chine
Matériel en cristal:
Monocristal al₂o₃
Structure cristalline:
Trigonal (Hexagonal)
Options d'orientation:
Plan C (0001), plan A (11-20), plan R (1-102), plan M (10-10), personnalisé
Gamme de tailles (carré):
5 × 5 mm – 150 × 150 mm
Plage d'épaisseur:
0,2 à 10 mm (tel que coupé)
Condition de surface:
As-Cut (non poli), rodage/SSP/DSP en option
Rugosité de surface (RA):
Tel que coupé : 0,5 à 2,0 µm (en fonction du tranchage)
Dureté (Mohs):
9
Densité:
30,98 g/cm3
Module d'Young:
345 à 400 GPa
Conductivité thermique:
25–35 W/m·K à 20 °C
Coefficient de dilatation thermique:
5,0–8,4 ×10⁻⁶ /K (en fonction de l'orientation)
Plage de transmission optique:
0,15 à 5,5 μm
Constante diélectrique:
9,4-11,5
Description de produit

Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications


Product Overview


Sapphire square raw wafer blanks are semi-finished single-crystal sapphire plates sliced directly from oriented sapphire boules. These blanks retain an as-cut, unpolished surface with natural saw marks and roughness, making them ideal for downstream precision processing including grinding, lapping, CMP polishing, thinning, and special-shape machining.


The material is α-Al₂O₃ single crystal, known for its exceptional hardness (Mohs 9), high thermal stability, strong chemical resistance, and wide optical transmission range. These characteristics make sapphire the preferred material for semiconductor wafers, optical windows, infrared components, and high-performance protective covers.


ZMSH provides sapphire raw blanks in a full range of dimensions, orientations, and thicknesses, offering complete customization according to customer processing requirements.

Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications 0Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications 1


Key Characteristics


  • Extreme Hardness (Mohs 9) — second only to diamond, scratch-resistant, wear-proof.

  • Excellent Optical Transmission — covers 0.15–5.5 μm (UV–Visible–Infrared).

  • High Thermal Stability — melting point 2053°C; withstands rapid thermal cycling.

  • Chemical Inertness — insoluble in most acids and bases (except HF & hot H₃PO₄).

  • Superior Electrical Insulation — stable dielectric properties at high temperatures.

  • Low Defect Density — ideal for semiconductor and optoelectronic processing.


Technical Specifications


Category Specification
Crystal Material Single Crystal Al₂O₃
Crystal Structure Trigonal (Hexagonal)
Orientation Options C-plane (0001), A-plane (11-20), R-plane (1-102), M-plane (10-10), Custom
Size Range (Square) 5 × 5 mm – 150 × 150 mm
Thickness Range 0.2–10 mm (as-cut)
Surface Condition As-Cut (Unpolished), optional Lapping/SSP/DSP
Surface Roughness (Ra) As-cut: 0.5–2.0 µm (dependent on slicing)
Hardness (Mohs) 9
Density 3.98 g/cm³
Young’s Modulus 345–400 GPa
Thermal Conductivity 25–35 W/m·K @ 20°C
Melting Point 2053°C
Coefficient of Thermal Expansion 5.0–8.4 ×10⁻⁶ /K (orientation dependent)
Refractive Index n₀=1.768, nₑ=1.760
Optical Transmission Range 0.15–5.5 μm
Dielectric Constant 9.4–11.5
Chemical Resistance Excellent; resistant to most acids/alkalis
Electrical Resistivity >10¹⁴ Ω·cm
Packaging Class-100 cleanroom


Applications


1. Semiconductor & LED Manufacturing

  • Raw material for polished sapphire wafers

  • GaN, AlN, Ga₂O₃ epitaxy

  • Micro-LED substrates

  • RF and power device components


2. Optical & Infrared Components

  • Infrared window blanks

  • High-temperature viewports

  • Laser protection windows

  • Optical flat substrates


3. Consumer Electronics

  • Camera lens cover (after polishing)

  • Fingerprint sensor covers

  • Smartwatch & wearable cover plates


4. Industrial & Scientific

  • High-pressure observation windows

  • Barcode scanner windows

  • Semiconductor equipment viewports


5. Aerospace & Defense

  • IR seeker windows

  • Optical domes

  • High-speed radome materials

  • Windows for harsh environments


ZMSH Processing Capability


ZMSH provides end-to-end sapphire machining services:

  • Crystal growth (KY/CZ)

  • Orientation & slicing

  • Lapping / grinding / thinning

  • CMP super-polishing

  • Chamfering & edge shaping

  • Step, slot, hole, and custom-shape machining

  • Ultra-thin & large-size sapphire processing

We provide one-stop solutions from raw blank to ready-to-use sapphire components.


FAQ


1. What is the difference between a raw wafer blank and a finished wafer?


A raw wafer blank is unpolished and retains as-cut roughness; finished wafers undergo precision grinding and CMP polishing.


2. Can the blank be customized?


Yes. Size, plane orientation, thickness, chamfering, and surface condition can all be customized.


3. Is sapphire suitable for infrared windows?


Yes. It has high transmittance from UV to mid-infrared (0.15–5.5 μm).


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