Les tailles standard sont 350 μm, 500 μm et 650 μm
Résistivité:
≥1×10¹⁰ Ω・cm (spécifications électriques de base HPSI)
Traitement de surface:
Polissage miroir CMP simple face/double face
Densité de Micropipe:
Qualité de production en série ≤1 pièce/cm²
Description de produit
Information of HPSI SiC Wafers HPSI (High Purity Semi-Insulating) silicon carbide wafers are critical foundational substrates for high-frequency GaN RF devices and advanced third-generation semiconductors. With the rapid expansion of 5G communication, millimeter-wave radar and aerospace electronics markets, the global SiC substrate market is projected to exceed USD 2 billion by 2030, playing an irreplaceable strategic role in next-generation wireless communication and high